SUSS MicroTec聯(lián)合iX-factory開(kāi)發(fā)微流體和集成光學(xué)MEMS方案

        SUSS MicroTec, supplier of innovative solutions for 3D Integration, Advanced Packaging, MEMS, Nanotechnology and Compound Semiconductor markets, and iX-factory, a leading expert for single wafer production and technical services, announced today that they are closely cooperating on microfludics and integrated optical applications. iX-factory develops its technologies on equipment platforms that include the newly launched MA/BA8 Gen3 mask and bond aligner and the CB8 wafer bonder from SUSS Micro
Tec.

        The MA/BA8 Gen3 represents the latest development of SUSS MicroTec’s manual aligner platform. Its unmatched alignment precision coupled with high resolution and maximum light uniformity makes it the system of choice for a variety of applications ranging from MEMS and 3D Packaging to micro-optics and nanotechnology. The CB8 high performance wafer bonder complements the mask and bond aligner offering excellent pressure uniformity and a unique vacuum-isolated, multi-zone heater. The CB8 supports all standard MEMS packaging bonding applications, such as eutectic, fusion, and metal diffusion bonding.

        “Mask aligner and bonder technology from SUSS MicroTec meet our high performance requirements by combining first class quality and precise performance with high versatility and ease of use.” Dominique Bouwes, CEO of iX-factory GmbH comments. “As an integral partner, SUSS MicroTec strengthens our ability to meet the full spectrum of our customers’ advanced micro and nano technology needs.”

        “We are proud to play an important role in the continuous education and exploration of the MEMS and nanotechnology field ”, said Rolf Wolf, General Manager for the Lithography Division at SUSS MicroTec. “Partnering with iX-factory provides SUSS MicroTec with the challenging opportunity to further expand its technological leadership in the MEMS and nanotechnology market.”