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id='a225770a' name='a225770a' src='https://ad.eepw.com.cn/www/delivery/afr.php?zoneid=87&cb=INSERT_RANDOM_NUMBER_HERE' frameborder='0' scrolling='no' width='300' height='200'><a target='_blank'><img src='https://ad.eepw.com.cn/www/delivery/avw.php?zoneid=87&cb=INSERT_RANDOM_NUMBER_HERE&n=a576c0a2' border='0' alt='' /></a></iframe> </div> <span id="contentlabels" style="font-size:14px;"><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;visibility: visible">AMD在7日凌晨 2 點(diǎn)舉辦“Advancing AI”活動(dòng)中，發(fā)布了Instinct MI300X人工智能加速器和全球首款數據中心APU--Instinct MI300A，以充分利用蓬勃發(fā)展的人工智能和高性能計算市場(chǎng)。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;visibility: visible"><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;letter-spacing: 0.578px;visibility: visible">受此消息影響，昨日AMD美股收盤(pán)大漲9.89%。<br /></span></span><p style="margin-top: 16px;margin-bottom: 16px;padding: 0px;outline: 0px;max-width: 100%;clear: both;min-height: 1em;text-align: left;visibility: visible;box-sizing: border-box !important;overflow-wrap: break-word !important"><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/6797d62a68564a81e25895061646627a.png" alt="圖片" /></p><p style="margin-top: 16px;margin-bottom: 16px;padding: 0px;outline: 0px;max-width: 100%;clear: both;min-height: 1em;text-align: left;box-sizing: border-box !important;overflow-wrap: break-word !important"><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em;text-align: justify">AMD 利用有史以來(lái)最先進(jìn)的量產(chǎn)技術(shù)打造了 MI300 系列產(chǎn)品，采用 "3.5D "封裝等新技術(shù)生產(chǎn)出兩款多芯片巨型處理器，并稱(chēng)可在各種 AI 工作負載中提供與 Nvidia 不相上下的性能。<span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;letter-spacing: 0.578px">其中有多項性能指標評測數倍于競爭對手英偉達的H100。</span></span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em;text-align: justify">AMD 沒(méi)有透露其新的奇特芯片的價(jià)格，但這些產(chǎn)品現已向眾多 OEM 合作伙伴發(fā)貨。</span></p><p style="margin-top: 0px;margin-bottom: 0px;padding: 0px;outline: 0px;max-width: 100%;clear: both;min-height: 1em;text-align: center;box-sizing: border-box !important;overflow-wrap: break-word !important"><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/f53d6856575713064c6bbd1a0bf92b33.png" alt="圖片" /></p><p style="margin-top: 0px;margin-bottom: 16px;padding: 0px;outline: 0px;max-width: 100%;clear: both;min-height: 1em;box-sizing: border-box !important;overflow-wrap: break-word !important"><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">Instinct MI300 是一種改變游戲規則的設計 - 數據中心 APU 混合了總共 13 個(gè)小芯片，其中許多是 3D 堆疊的，以創(chuàng )建一個(gè)具有 24 個(gè) Zen 4 CPU 內核并融合了 CDNA 3 圖形引擎和 8 個(gè)堆棧的芯片HBM3?？傮w而言，該芯片擁有 1530 億個(gè)晶體管，是 AMD 迄今為止制造的最大芯片。AMD 聲稱(chēng)該芯片在某些工作負載中的性能比 Nvidia H100 GPU 高出 4 倍，并宣稱(chēng)其每瓦性能是其兩倍。 </span></p><p style="margin-top: 0px;margin-bottom: 16px;padding: 0px;outline: 0px;max-width: 100%;clear: both;min-height: 1em;box-sizing: border-box !important;overflow-wrap: break-word !important"><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">AMD 表示，其 Instinct MI300X GPU 在人工智能推理工作負載中的性能比 Nidia H100 高出 1.6 倍，并在訓練工作中提供類(lèi)似的性能，從而為業(yè)界提供了急需的 Nvidia GPU 的高性能替代品。此外，這些加速器的 HBM3 內存容量是 Nvidia GPU的兩倍以上（每個(gè) 192 GB 令人難以置信），使其 MI300X 平臺能夠支持每個(gè)系統兩倍以上的 LLM 數量，并運行比 Nvidia H100 HGX 更大的模型。 </span></p><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 18px"><strong style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important"><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;color: rgb(0, 82, 255)">AMD Instinct MI300X</span></strong></span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">MI300X代表了 AMD 基于小芯片的設計方法的頂峰，將八個(gè) 12Hi 堆棧的 HBM3 內存與八個(gè) 3D 堆棧的 5nm CDNA 3 GPU 小芯片（稱(chēng)為 XCD）融合在四個(gè)底層 6nm I/O 芯片上，這些芯片使用 AMD 現已成熟的技術(shù)進(jìn)行連接混合鍵合技術(shù)。</span><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/0653e62b286100553e17abce5b0c44ec.png" alt="圖片" /><br /><p></p><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/a0b7a41cb9bf32698b8ea60e9d3b8f2d.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/916009f4d3352cad5f09da4d859bacf4.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/99aa7109b32eb2867696dc2ca423637a.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/b7df6f5ab1b7f250a16b5094c1e2e7db.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/5bca44e581f0a3cbc47f3ccb38444227.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/6534a0136f6f612e136715f0fe071f85.png" alt="圖片" /><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">結果是創(chuàng )造出了一個(gè) 750W 的加速器，擁有 304 個(gè)計算單元、192GB HBM3 容量和 5.3 TB/s 帶寬。該加速器還具有 256MB Infinity Cache，用作共享 L3 緩存層，以促進(jìn)小芯片之間的通信。AMD 將其將小芯片綁定在一起的封裝技術(shù)稱(chēng)為“3.5D”，表示 3D 堆疊 GPU 和 I/O 芯片通過(guò)混合鍵合融合在一起，并與模塊其余部分的標準 2.5D 封裝（水平連接）相結合。。我們將更深入地研究下面的架構組件。<br /></span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">MI300X 加速器設計用于在 AMD 的生成式 AI 平臺中以 8 個(gè)為一組工作，GPU 之間通過(guò) Infinity Fabric 互聯(lián)實(shí)現 896 GB/s 的吞吐量。該系統擁有 1.5TB 的 HBM3 內存，性能高達 10.4 Petaflops（BF16/FP16）。該系統基于開(kāi)放計算項目（OCP）通用底板（UBB）設計標準構建，從而簡(jiǎn)化了采用過(guò)程，特別是對于超大規模用戶(hù)而言。<br />與 Nvidia 的 H100 HGX 平臺（BF16/FP16）相比，AMD 的 MI300X 平臺內存容量增加了 2.4 倍，計算能力提高了 1.3 倍，同時(shí)還保持了相當的雙向和單節點(diǎn)環(huán)帶寬。AMD 為 MI300X 平臺配備了 400GbE 網(wǎng)絡(luò )，并支持多種網(wǎng)卡，而 Nvidia 則傾向于使用其收購 Mellanox 后生產(chǎn)的自有網(wǎng)絡(luò )產(chǎn)品。</span><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/ba8d049c30941ac0b422e40dda418e57.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/f32afad28476c9bf41672798b8a22937.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/bad838eb4ace81a48516e1078627b753.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/52d820056e84bc7cb894d075605a51da.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/387614c505c50829f88954dd1ec42eec.png" alt="圖片" /><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">一如既往，我們應該謹慎對待供應商的基準測試。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">AMD </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">分享了一系列性能指標，顯示其在</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> HPC </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">工作負載方面的</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> FP64 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">和</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> FP32 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">向量矩陣吞吐量峰值理論值是</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> H100 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">的</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> 2.4 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">倍，在人工智能工作負載方面的</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> TF32</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">、</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">FP16</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">、</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">BF16</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">、</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">FP8 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">和</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> INT8 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">吞吐量峰值理論值是</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> H100 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">的</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> 1.3 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">倍，所有這些都是在沒(méi)有稀疏性的情況下預測的（不過(guò)</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> MI300X </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">確實(shí)支持稀疏性）。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">MI300X 的大內存容量和帶寬非常適合推理。AMD 使用 1760 億參數的 Flash Attention 2 模型聲稱(chēng)在令牌/秒吞吐量方面比 Nvidia H100 具有 1.6 倍的性能優(yōu)勢，并使用 700 億參數的 Llama 2 模型來(lái)強調 1.4 倍的聊天延遲優(yōu)勢（從2K 序列長(cháng)度/128 個(gè)令牌工作負載的開(kāi)始到結束）。<br /><br />AMD 的 MI300X 平臺在 300 億參數 MPT 訓練工作負載中提供的性能與 H100 HGX 系統大致相同，但需要注意的是，此測試并不是加速器的一對一比較。相反，該測試讓八個(gè)加速器組相互競爭，因此平臺級功能更像是一個(gè)限制因素。無(wú)論哪種情況，這種性能都會(huì )很快引起受到 Nvidia GPU短缺困擾的行業(yè)的興趣。<br />在平臺功能方面，AMD 還宣稱(chēng)，MI300X 平臺的內存容量?jì)?yōu)勢允許托管的 300 億參數訓練模型和 700 億數推理模型數量是 H100 系統的兩倍。此外，MI300X 平臺還可支持多達 70B 的訓練模型和 2900 億參數的推理模型，兩者都是 H100 HGX 所支持模型的兩倍。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">當然，</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">Nvidia 即將推出的 H200 GPU</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">在內存容量和帶寬方面將更具競爭力，而計算性能將與現有的 H100 保持相似。Nvidia 要到明年才會(huì )開(kāi)始發(fā)貨 H200，因此與 MI300X 的競爭仍然存在。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 18px"><strong style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important"><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;color: rgb(0, 82, 255)">AMD Instinct MI300A</span></strong></span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">AMD Instinct MI300A 是全球首款數據中心 APU，這意味著(zhù)它將 CPU 和 GPU 結合在同一個(gè)封裝中。它將直接與</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">Nvidia 的 Grace Hopper Superchips</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">競爭，后者的 CPU 和 GPU 位于單獨的芯片封裝中，可以協(xié)同工作。MI300A 已經(jīng)在</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">El Capitan 超級計算機</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">中取得了顯著(zhù)的勝利，AMD 已經(jīng)將該芯片運送給其合作伙伴。</span><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/c28d69a9ec17b0acd4c9ff0e93badd45.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/5745be21122842dc6931262d710d24ca.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/ac3e20251429110ccbf18959e2291fed.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/a68b33d4544920c589aa9139f9e887e0.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/a696022aab42ded5453cdc5e529baebc.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/8ace6a033b563b1ad8406350aab716ec.png" alt="圖片" /><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">MI300A使用與 MI300X 相同的基本設計和方法，但替換為三個(gè) 5nm 核心計算芯片 (CCD)，每個(gè)核心具有八個(gè) Zen 4 CPU 核心，與 EPYC 和 Ryzen 處理器上的相同，從而取代了兩個(gè) XCD GPU 小芯片。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">這使得 MI300A 配備了 24 個(gè)線(xiàn)程 CPU 內核和分布在 6 個(gè) XCD GPU 小芯片上的 228 個(gè) CDNA 3 計算單元。與 MI300X 一樣，所有計算小芯片均采用混合鍵合方式與四個(gè)底層 I/O 芯片 (IOD) 進(jìn)行 3D 堆疊，以實(shí)現遠超標準芯片封裝技術(shù)所能實(shí)現的帶寬、延遲和能源效率。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">AMD 壓縮了內存容量，使用了 8 個(gè) 8Hi HBM3 堆棧，而不是 MI300X 使用的 8 個(gè) 12Hi 堆棧，因此容量從 192GB 降至 128GB。不過(guò)，內存帶寬仍為 5.3 TB/s。AMD 告訴我們，減少內存容量的決定并不是因為功耗或散熱限制；相反，這是為目標 HPC 和 AI 工作負載量身定制的芯片。無(wú)論如何，128GB 的容量和 5.3 TB/s 的吞吐量仍比 Nvidia 的 H100 SXM GPU 高出 1.6 倍。<br />MI300A 的默認 TDP 為 350W，但可配置為最高 760W。AMD 根據使用情況在芯片的 CPU 和 GPU 部分之間動(dòng)態(tài)分配功率，從而優(yōu)化性能和效率。AMD 盡可能巧妙地重復利用：MI300A 插入 AMD 的標準 LGA6096 插槽，就像 EPYC Genoa 處理器一樣，但該插槽的 SH5 版本與使用 SP5 的 AMD EPYC 處理器在電氣上不兼容。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">內存空間在 CPU 和 GPU 之間共享，從而消除了數據傳輸。該技術(shù)通過(guò)消除單元之間的數據傳輸來(lái)提高性能和能源效率，同時(shí)還減少編碼負擔。與 MI300X 一樣，該芯片具有中央 256MB Infinity Cache，有助于確保流經(jīng)芯片的數據的帶寬和延遲。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">AMD 聲稱(chēng) FP64 Matrix/DGEMM 和 FP64/FP32 Vector TFLOPS 比 H100 高出 1.8 倍。該公司還聲稱(chēng) TF32、FP16、BF16、FP8 和 INT8 與 H100 相同。</span><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/3cb151e8b6a7d5aa74dd75681b6bf4de.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/bb44c5ca498a57be3efcc33e4eb48bcd.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/decffc4b03ce8c7b1e22603022b150cc.png" alt="圖片" /><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">AMD</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">聲稱(chēng)，在</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> OpenFOAM HPC </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">motorbike </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">測試中，其</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> MI300A </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">比</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> Nvidia </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">的</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> H100 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">快</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> 4 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">倍，但這種比較并不理想：</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> H100</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">是</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">GPU</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">，而</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">MI300A</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">的</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">CPU</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">和</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">GPU</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">混合計算通過(guò)共享內存尋址空間，在這種內存密集型、有時(shí)是串行的工作負載中提供了固有優(yōu)勢。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">如果與</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> Nvidia Grace Hopper GH200 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">超級芯片進(jìn)行比較，效果會(huì )更好，該芯片也是將</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> CPU </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">和</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> GPU </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">緊密耦合在一起實(shí)現的，但</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> AMD </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">表示無(wú)法找到</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> Nvidia GH200 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">的任何公開(kāi)</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> OpenFOAM </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">結果。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">AMD 確實(shí)提供了與 Nvidia GH200 的每瓦性能比較數據，以強調 2 倍的優(yōu)勢，這些結果基于有關(guān) H200 的公開(kāi)信息。AMD 還強調了與 H100 在 Mini-Nbody、HPCG 和 Gromacs 基準測試中的比較，聲稱(chēng)分別領(lǐng)先 1.2 倍、1.1 倍和 1.1 倍。同樣，對于這組基準測試，與 GH200 進(jìn)行比較會(huì )更理想。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 18px"><strong style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important"><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;color: rgb(0, 82, 255)">AMD Instinct MI300X 和 MI300A 架構</span></strong></span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">我們介紹了上面設計的基礎知識，這些細節為理解下面的部分提供了重要的視角。</span><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/26690cb4ab1e897e9f228c9f3269b121.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/2b6d5348c98b091beec2a2259f48653b.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/75920f21f52bfcca728b9654060a86ee.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/8d3e0e523bee45699ca20612aa55402c.png" alt="圖片" /><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">AMD利用臺積電的 3D 混合鍵合 SoIC（集成電路上硅）技術(shù)，在四個(gè)底層 I/O 芯片之上對各種計算元件進(jìn)行 3D 堆疊，無(wú)論是 CPU CCD（核心計算芯片）還是 GPU XCD。每個(gè) I/O 芯片可以容納兩個(gè) XCD 或三個(gè) CCD。每個(gè) CCD 與現有 EPYC 芯片中使用的 CCD 相同，每個(gè) CCD 擁有八個(gè)超線(xiàn)程 Zen 4 核心。MI300A 使用了其中的三個(gè) CCD 和六個(gè) XCD，而 MI300X 使用了八個(gè) XCD。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">HBM 堆棧使用采用 2.5D 封裝技術(shù)的標準中介層進(jìn)行連接。AMD 將 2.5D 和 3D 封裝技術(shù)相結合，使該公司創(chuàng )造了“3.5D”封裝的綽號。每個(gè) I/O 芯片都包含一個(gè) 32 通道 HBM3 內存控制器，用于托管 8 個(gè) HBM 堆棧中的兩個(gè)，從而為該設備提供了總共 128 個(gè) 16 位內存通道。MI300X 采用 12Hi HBM3 堆棧，容量為 192GB，而 MI300A 使用 8Hi 堆棧，容量為 128GB。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">AMD 還增加了 256MB 的無(wú)限緩存總容量，分布在所有四個(gè) I/O 芯片上，通過(guò)預取器緩存數據流量，從而提高命中率和電源效率，同時(shí)減少總線(xiàn)爭用和延遲。這為 CPU 增加了新級別的緩存（概念上是共享 L4），同時(shí)為 GPU 提供共享 L3 緩存。Infinity Fabric NoC（片上網(wǎng)絡(luò )）被稱(chēng)為 AMD Infinity Fabric AP（高級封裝）互連，用于連接 HBM、I/O 子系統和計算。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">該芯片總共具有 128 個(gè) PCIe 5.0 連接通道，分布在四個(gè) I/O 芯片上。它們被分為兩組：一組是四個(gè) x16 PCIe 5.0 + 第四代 Infinity Fabric 鏈路的組合，而另一組則有四個(gè)專(zhuān)門(mén)用于 Infinity Fabric 的 x16 鏈路。后者僅用于將 MI300 相互連接（跨套接字流量）。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">MI300X 純粹用作端點(diǎn)設備 - 它連接到外部 CPU - 因此其 PCIe 根節點(diǎn)需要充當端點(diǎn)設備。相比之下，MI300A 由于其本機 CPU 內核而采用自托管，因此 PCIe 根聯(lián)合體必須充當主機。為了適應這兩種場(chǎng)景，AMD 定制的 MI300 I/O 裸片支持來(lái)自同一 PCIe 5.0 根節點(diǎn)的兩種模式，該根節點(diǎn)是該公司 IP 產(chǎn)品組合的新成員。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">AMD 的 CPU CCD 通過(guò) 3D 混合鍵合到底層 I/O 芯片，需要新的接口。雖然這與 EPYC 服務(wù)器處理器中的 CCD 相同，但這些芯片通過(guò)利用標準 2.5D 封裝的</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">GMI3 (Global Memory Interconnect 3) 接口進(jìn)行通信。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">對于 MI300，AMD 添加了一個(gè)新的焊盤(pán)通孔接口，可繞過(guò) GMI3 鏈路，從而提供垂直堆疊芯片所需的 TSV（通過(guò)硅通孔）。該接口在雙鏈路寬模式下運行。<br />5nm XCD GPU 芯片標志著(zhù) AMD GPU 設計的全面小芯片化。與 MI200 中使用的小芯片表現為兩個(gè)獨立的設備不同，MI300 小芯片則是表現為一個(gè)單片 GPU。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">每個(gè) XCD 有 40 個(gè)物理 CDNA3 計算單元，但只有 38 個(gè)被激活（這有助于解決良率問(wèn)題）。每個(gè) 38-CU 小芯片都有 4MB 共享 L2 (16x 256KB)。XCD 和 IOD 具有硬件輔助機制，可將作業(yè)分解為更小的部分、分派它們并保持它們同步，從而減少主機系統開(kāi)銷(xiāo)。這些單元還具有硬件輔助的緩存一致性。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">上圖中的最后一張PPT展示了 CDNA 3 計算單元的增強功能和性能。</span><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/8a3c4efd5aa4854eef95fc9b8bf120df.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/fe0ff3bbb6f6348d6dbc924e185b37ad.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/0d7eee2764917e0f463f7c53bfb6643f.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/e67108a8e5c22803308eafc5623a04e4.png" alt="圖片" /><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">每個(gè)</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> I/O </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">裸片上連接有兩個(gè)</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> XCD</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">，然后連接到兩個(gè)</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> HBM3 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">堆棧。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">這樣，</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">GPU </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">就能與兩個(gè)連接的堆棧進(jìn)行私密通信，以緩解帶寬、延遲和一致性問(wèn)題。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">不過(guò)，每個(gè)</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> XCD </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">都可以與任何內存堆棧通信（</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">I/O </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">裸片之間的</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> Infinity Fabric </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">連接在</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">PPT</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">的前兩張圖片中以彩色條形直觀(guān)顯示）。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">當然，尋址遠程堆棧會(huì )帶來(lái)延遲損失。內存事務(wù)傳輸得越遠，就會(huì )產(chǎn)生越長(cháng)的延遲。AMD 指出，直接連接到 IOD 和 XCD 的 HBM 是零跳事務(wù)(zero-hop)，而訪(fǎng)問(wèn) IOD 上的不同內存堆棧則需要兩跳。最后，訪(fǎng)問(wèn)相鄰 IOD 上的內存堆棧是三跳跳轉。兩跳跳轉的延遲大約增加 30%，而三跳跳轉的延遲則增加 60%。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">第三張PPT顯示了 NoC 提供的帶寬，在整個(gè)封裝的垂直部分，I/O Dies 之間的帶寬為 1.2 TB/s/dir，而水平數據路徑提供的帶寬略高，為 1.5 TB/s/dir，以幫助容納來(lái)自 I/O 設備的額外流量，從而允許 I/O 流量與內存流量分開(kāi)處理。封裝右側和左側的 PCIe可從每個(gè) I/O 芯片提供 64 GB/s/dir 的吞吐量。在封裝的頂部和底部，可以看到每個(gè) HBM 堆棧提供 665 GB/s 的吞吐量。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">AMD 有多種分區方案，可將計算單元劃分為不同的邏輯域，就像 EPYC 處理器的 NPS 設置一樣。這允許將不同的 XCD 分成不同的組以?xún)?yōu)化帶寬，從而最大限度地提高性能并限制“NUMAness”的影響。多種配置范圍從將單元尋址為一個(gè)邏輯設備到將它們尋址為八個(gè)不同的設備，以及多種中間選項，為各種工作負載提供了足夠的靈活性。 </span><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/62333a5622999faae9b08b7d3923c04b.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/d416a2974a9a630c0f473fcf9c7a4f98.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/9ffdf38f06cedc4afa98f80084f8e1f2.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/475ab18868b81682a612395a3b84ed5b.png" alt="圖片" /><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">AMD確定 3D 混合鍵合 (SoIC) 是在計算單元和 I/O 芯片之間提供足夠帶寬的唯一現實(shí)途徑。公司在該技術(shù)方面擁有豐富的經(jīng)驗；它已經(jīng)應用于數百萬(wàn)個(gè)配備 3D V-Cache的 PC 處理器中。 <br /></span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">該公司在這種</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">現已成熟的混合鍵合技術(shù)</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">方面積累的長(cháng)期經(jīng)驗使其有信心在 MI300 處理器中繼續采用該技術(shù)。與由 3D V-Cache和標準型號組成的 AMD 消費類(lèi) PC 芯片系列相比，MI300 處理器代表該公司首次在整個(gè)產(chǎn)品堆棧中完全依賴(lài)該技術(shù)。 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">總體而言，SoC 連接可在各種 3D 堆疊單元中提供高達 17 TB/s 的垂直帶寬。SoIC 尺寸為 13x29mm。 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">專(zhuān)輯最后一張PPT中的剖面圖展示了 3.5D 封裝方法的復雜性和美妙之處。。它說(shuō)明了如何從底部使用有機基板、上方具有金屬布線(xiàn)和 TSV 的 CoWos 無(wú)源硅中介層，以及采用混合鍵合（9 微米間距）的 3D 堆疊 IOD 和 XCD 來(lái)構建封裝。將有機基板與硅中介層（底部）配合的巨大銅凸塊突出了 3D 堆疊部分的頂部和底部芯片（靠近頂部）之間幾乎不可見(jiàn)的混合鍵合連接是多么小和密集。芯片）。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">混合鍵合技術(shù)需要減薄芯片以暴露 TSV，以便它們可以配對。因此，AMD 必須在封裝頂部采用硅墊片以保持結構完整性，就像其他配備 3D V-Cache 的處理器一樣。 </span><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/c61afa765455a5aef40bfbb39559ff29.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/c05383018498b775e195968d10761237.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/d86d682a246de1eee7999b5b58c78953.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/efc19fecd042b41b1b72ddf1d9066055.png" alt="圖片" /><img class="rich_pages wxw-img" src="http://editerupload.eepw.com.cn/fetch/202312/13fa8a29db8b322642ecfaee938fea37.png" alt="圖片" /><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">AMD</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">高級副總裁、</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">AMD </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">公司院士兼產(chǎn)品技術(shù)架構師</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em"> Sam Naffziger</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px;letter-spacing: 0.034em">介紹了團隊在設計階段遇到的一些挑戰。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">巧妙的IP重用一直是AMD小芯片戰略的基石，MI300也不例外。MI300 團隊沒(méi)有資源為 MI300 構建全新的 CPU CCD，因此他們要求該公司的 CCD 團隊在設計階段的早期將 3D 接口 (TSV) 添加到 EPYC CCD。令人驚訝的是，工程團隊找到了一種將連接塞入現有 GMI 接口之間的方法。 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">在第一張幻燈片中，您可以看到兩個(gè)小藍點(diǎn)代表 TSV 的總面積，而點(diǎn)兩側的大橙色矩形塊是用于 2.5D 封裝的標準 GMI3 接口。這說(shuō)明了 SoIC 技術(shù)的密度和面積效率是多么令人難以置信。AMD 還添加了一些門(mén)、開(kāi)關(guān)和多路復用器，以允許信號從 GMI3 接口重新路由到 3D 接口。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">AMD創(chuàng )建了 I/O Die的鏡像版本，以確保它們可以旋轉到正確的位置，同時(shí)確保 XCD 中的內存控制器和其他接口仍然正確對齊。工程團隊對稱(chēng)地設計了接口/信號和電源連接，從而允許小芯片旋轉，如第二張圖所示。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">然而，雖然 AMD 專(zhuān)門(mén)為 MI300 從頭開(kāi)始設計了 I/O Die，但該團隊必須采用 EPYC 的現有 CCD 設計。他們不想為 CCD 創(chuàng )建鏡面掩模組，這在此類(lèi)設計中通常是必需的，以確保正確的接口對齊，因為這會(huì )增加設計的成本和復雜性。然而，其中兩個(gè) CCD 需要旋轉 180 度才能確保正確對齊。然而，CCD的外部接口設計不對稱(chēng)，因此帶來(lái)了挑戰。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">如第三張幻燈片所示，AMD 通過(guò)在 I/O Die上的鍵合焊盤(pán)通孔 (BPV) 連接點(diǎn)添加一些冗余來(lái)克服這一挑戰，從而允許 CCD 僅旋轉而不是鏡像。</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">不過(guò)，供電輸送仍然是一個(gè)挑戰。TSV 是非常小的銅插頭，AMD 需要為位于 I/O Die頂部的計算芯片提供數百安培的電源。細小的 TSV 不太適合這項工作，因此它們需要大量的連接來(lái)供電。AMD 設計了一種新的電網(wǎng)來(lái)克服這個(gè)問(wèn)題，它滿(mǎn)足了 IR 壓降目標，并且沒(méi)有超過(guò)電流密度限制。 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">最后，由于 3D 堆疊設計，該設計提出了一些新的熱挑戰。通過(guò)熱建模，AMD 確定了兩種類(lèi)型的極端操作條件 - 內存密集型和 GPU 密集型 - 然后利用其基于使用模式在單元之間動(dòng)態(tài)轉移功率的行之有效的策略來(lái)幫助緩解這些問(wèn)題。 </span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;font-size: 16px">因此，一個(gè)令人難以置信的處理器誕生了。AMD的MI300在相當長(cháng)的一段時(shí)間內對Nvidia在A(yíng)I和HPC工作負載方面的性能主導地位提出了第一次真正的挑戰，AMD堅稱(chēng)自己有能力滿(mǎn)足需求。在 GPU 短缺的時(shí)代，這是一種競爭優(yōu)勢，并且肯定會(huì )刺激行業(yè)的快速發(fā)展。AMD 現在正在向其合作伙伴運送 MI300 處理器。</span><br /><strong style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important"><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;color: rgb(136, 136, 136);font-size: 12px;letter-spacing: 0.408px;text-align: center">來(lái)源：</span><span style=";padding: 0px;outline: 0px;max-width: 100%;box-sizing: border-box !important;overflow-wrap: break-word !important;color: rgb(136, 136, 136);font-size: 12px;letter-spacing: 0.408px;text-align: center">EETOP</span></strong><p></p><p><br /></p></span> <p style="color:#666; padding-top:30px;">*博客內容為網(wǎng)友個(gè)人發(fā)布，僅代表博主個(gè)人觀(guān)點(diǎn)，如有侵權請聯(lián)系工作人員刪除。</p>  <div class="nzaunuo" id="coverDiv" class="article_reg" style="width:100%;overflow:hidden;display:none;z-index:10;position:absolute;left:0;background:#fff;"> <center> 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